Fraunhofer Heilbronn Research and Innovation Centers HNFIZAI Chip Design for the Next Generation of AI Hardware
Artificial intelligence (AI) and semiconductor technology are driving a new generation of powerful, energy-efficient, and secure computing systems. Particularly high innovation potential lies in combining AI with specialized chip design. The Research and Innovation Center for Chip AI, jointly run by the Fraunhofer Institute for Applied Solid State Physics IAF and the Fraunhofer Institute for Integrated Circuits IIS, is dedicated to this interface, where AI-assisted design processes meet novel hardware architectures. The focus is both on developing chips for AI applications and on using AI to automate and secure chip design. The goal is to establish AI hardware “Made in Germany” as a configurable and competitive key technology. The research portfolio is specifically geared toward addressing current challenges faced by industry and society. In close cooperation with companies, universities, and public institutions, the rapid transfer of research results into practical applications is to be enabled. The solutions developed are intended to have an impact across Europe from Heilbronn and to sustainably strengthen the region and Germany.
AI-powered chip design and secure design processes
At FIZ Chip AI, CMOS-based AI chips are being developed, including analog/mixed-signal designs for neuromorphic processor units. At the same time, AI methods are used to automate complex design steps, increase efficiency, and create new approaches for IP protection, verification, and certification of safety-critical applications.
Energy-efficient AI hardware and neuromorphic architectures
With neuromorphic processors and spiking neural networks, hardware solutions are emerging that are characterized by high energy efficiency and real-time capability, enabling AI applications directly on end devices, for example in robotics, mobile communications, or space travel. In addition, an associated software toolchain for training AI models is being integrated.
Knowledge transfer and qualification in AI chip design
Through joint projects, demonstrators, and tailored formats for industry and research, expertise in AI-based chip design and neuromorphic hardware is systematically transferred into practical applications and made usable for companies.
Ecosystem development for semiconductors and AI in Heilbronn
In close cooperation with IPAI, the Dieter Schwarz Foundation, and Fraunhofer Microelectronics, an ecosystem is growing in which research, industry, and policymakers jointly develop perspectives for AI hardware and strengthen Europe’s technological sovereignty in the AI sector. In addition, FIZ Chip AI links its activities with the broader Fraunhofer portfolio outside Baden-Württemberg in order to integrate further elements of the semiconductor value chain – from characterization and packaging technologies to (sub-)system engineering – into the development of innovative AI hardware.